Asus will officially unveil the ROG Phone 6D Ultimate on September 19, and according to past rumors, this will be joined by the ROG Phone 6D. The brand has already confirmed that the Ultimate will be powered by MediaTek’s Dimensity 9000+ SoC, and today it’s amping up the teasing by revealing that the ROG Phone 6D Ultimate will also have an unprecedented cooling system, which “allows airflow unlike any ROG Phone before”. See for yourself below.
The ULTIMATE thermal technology is coming on September 19!
The ROG Phone 6D Ultimate will feature a new advanced cooling system that allows airflow unlike any ROG Phone before.
— ROG Global (@ASUS_ROG) September 2, 2022
The ROG Phone 6D is also likely to sport a MediaTek chipset of some sort – perhaps the same Dimensity 9000+, maybe the non-“+” version of that, we’ll see, but we’re basing all of this on the assumption that the “D” in the name stands for “Dimensity”.
Based on the looks we saw in a leak of both models’ renders, we can probably also safely assume that the ROG Phone 6D is best thought of as the Dimensity version of the ROG Phone 6, while the ROG Phone 6D Ultimate would be the Dimensity-powered correspondent to the ROG Phone 6 Pro.
All will be officially revealed in just over two weeks – but in the meantime, Asus may release some new teasers, and we’ll share them with you as they come.